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dc.contributor.author김우승-
dc.date.accessioned2019-11-08T00:56:02Z-
dc.date.available2019-11-08T00:56:02Z-
dc.date.issued2005-11-
dc.identifier.citation대한기계학회논문집 B, v. 29, No. 11, Page. 1,173 - 1,181en_US
dc.identifier.issn1226-4881-
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00653232&language=ko_KR-
dc.identifier.urihttp://repository.hanyang.ac.kr/handle/20.500.11754/111990-
dc.description.abstractThe cooling effect of a mobile phone using PCM(Phase Change Material) module has been numerically investigated. A transient three-dimensional numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique has been used for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(multichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module considered in this study is negligible.en_US
dc.language.isoko_KRen_US
dc.publisher대한기계학회en_US
dc.title상변화 물질을 이용한 이동전화기의 냉각에 관한 연구en_US
dc.title.alternativeA Study of Cooling of Mobile Phone Using PCM Moduleen_US
dc.typeArticleen_US
dc.relation.journal대한기계학회논문집 B-
dc.contributor.googleauthor이상진-
dc.contributor.googleauthor정수진-
dc.contributor.googleauthor김우승-
dc.relation.code2012100289-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MECHANICAL ENGINEERING-
dc.identifier.pidwskim-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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