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상변화 물질을 이용한 이동전화기의 냉각에 관한 연구

Title
상변화 물질을 이용한 이동전화기의 냉각에 관한 연구
Other Titles
A Study of Cooling of Mobile Phone Using PCM Module
Author
김우승
Issue Date
2005-11
Publisher
대한기계학회
Citation
대한기계학회논문집 B, v. 29, No. 11, Page. 1,173 - 1,181
Abstract
The cooling effect of a mobile phone using PCM(Phase Change Material) module has been numerically investigated. A transient three-dimensional numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique has been used for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(multichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module considered in this study is negligible.
URI
http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00653232&language=ko_KRhttp://repository.hanyang.ac.kr/handle/20.500.11754/111990
ISSN
1226-4881
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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