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Simulator for resist-reflow process by boundary movement

Title
Simulator for resist-reflow process by boundary movement
Author
오혜근
Issue Date
2005-11
Publisher
한국물리학회
Citation
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v. 47, No. 9(3), Page. 377-380
Abstract
The thermal-reflow process is one of many processes used for pattern shrinkage and resolution-enhancement technology. In this study, resist-flow behavior and contact-hole shrinkage are described by using the thermal-reflow length of the boundary-movement method and analysis of the image process. For the boundary-movement method, the viscosity variable is extracted from the experimental data by using a proposed equation. The simulation results of the boundary-movement method agree well with the experimental results in both contact-hole sizes and vertical-wall profile according to the baking temperature and time. The most controllable process and parameter for the critical dimension in thermal reflow are the development process and the inhibition reaction order of the enhanced Mack model.
URI
http://www.jkps.or.kr/journal/view.html?uid=7363&vmd=Fullhttp://repository.hanyang.ac.kr/handle/20.500.11754/111745
ISSN
0374-4884; 1976-8524
Appears in Collections:
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > APPLIED PHYSICS(응용물리학과) > Articles
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