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dc.contributor.author김희준-
dc.date.accessioned2019-09-09T05:26:51Z-
dc.date.available2019-09-09T05:26:51Z-
dc.date.issued2005-04-
dc.identifier.citation2005 IEEE International Magnetics Conference (INTERMAG), Page. 555en_US
dc.identifier.issn2150-4598-
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/1463984-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/110399-
dc.description.abstractThe application of low temperature co-fired ceramics (LTCC) technology to ferrite has attracted much attention because LTCC can offer a high density of electronic components and interconnection possibilities in one multichip module package. In this regard, an experiment was conducted to fabricate a DC-DC converter using LTCC technology. Thick films were prepared by grinding calcined powders by wet ball milling and mixing binder, plasticizer, dispersant and solvent. Ferrite thick films were then fabricated using a doctor blade method. Experimental results clearly indicate that the ferrite thick film is suitable for LTCC application.en_US
dc.language.isoen_USen_US
dc.publisherIEEEen_US
dc.titleA fabrication of DC-DC converter using LTCC NiZnCu ferrite thick filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/INTMAG.2005.1463984-
dc.contributor.googleauthorMoon, K.W.-
dc.contributor.googleauthorHong, S.H.-
dc.contributor.googleauthorKim, H.J.-
dc.contributor.googleauthorKim, J.-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidhjkim-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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