Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김희준 | - |
dc.date.accessioned | 2019-09-09T05:26:51Z | - |
dc.date.available | 2019-09-09T05:26:51Z | - |
dc.date.issued | 2005-04 | - |
dc.identifier.citation | 2005 IEEE International Magnetics Conference (INTERMAG), Page. 555 | en_US |
dc.identifier.issn | 2150-4598 | - |
dc.identifier.uri | https://ieeexplore.ieee.org/abstract/document/1463984 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/110399 | - |
dc.description.abstract | The application of low temperature co-fired ceramics (LTCC) technology to ferrite has attracted much attention because LTCC can offer a high density of electronic components and interconnection possibilities in one multichip module package. In this regard, an experiment was conducted to fabricate a DC-DC converter using LTCC technology. Thick films were prepared by grinding calcined powders by wet ball milling and mixing binder, plasticizer, dispersant and solvent. Ferrite thick films were then fabricated using a doctor blade method. Experimental results clearly indicate that the ferrite thick film is suitable for LTCC application. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | IEEE | en_US |
dc.title | A fabrication of DC-DC converter using LTCC NiZnCu ferrite thick films | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/INTMAG.2005.1463984 | - |
dc.contributor.googleauthor | Moon, K.W. | - |
dc.contributor.googleauthor | Hong, S.H. | - |
dc.contributor.googleauthor | Kim, H.J. | - |
dc.contributor.googleauthor | Kim, J. | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DIVISION OF ELECTRICAL ENGINEERING | - |
dc.identifier.pid | hjkim | - |
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