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Patterning of Thin Copper Films under UV exposure in Chlorine-Based Liquids

Title
Patterning of Thin Copper Films under UV exposure in Chlorine-Based Liquids
Author
안일신
Keywords
copper films; etching; ultraviolet radiation; chlorine
Issue Date
2006-06
Publisher
한국물리학회
Citation
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v. 48, No. 6, Page. 1273-1276
Abstract
Wet etching of thin copper films was achieved by using chlorine-based liquids, such as 1,2-dicholorethane or NaCl dissolved in water, under ultraviolet (UV) irradiation. The etching of the thin copper film was probed in-situ by using a spectroscopic ellipsometer, and the etch rate could be controlled by adjusting the exposure parameters. As UV is used in lithography, mask patterns can be transferred to a copper surface directly without resorting to a complex photoresist process. Easy control of the etch rate ranging from sub A/s and use of nontoxic liquids such as 1,2-dicholoroethane and NaCl solution are major advantages of this novel technique.
URI
http://www.jkps.or.kr/journal/view.html?uid=7602&vmd=Fullhttp://repository.hanyang.ac.kr/handle/20.500.11754/108220
ISSN
0374-4884; 1976-8524
Appears in Collections:
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > PHOTONICS AND NANOELECTRONICS(나노광전자학과) > Articles
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