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dc.contributor.author이선영-
dc.date.accessioned2019-07-25T04:56:47Z-
dc.date.available2019-07-25T04:56:47Z-
dc.date.issued2006-04-
dc.identifier.citation19th IEEE International Conference on Micro Electro Mechanical Systems, Page. 922-925en_US
dc.identifier.issn1084-6999-
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/1627951-
dc.identifier.urihttp://repository.hanyang.ac.kr/handle/20.500.11754/107845-
dc.description.abstractIn this research, a wafer-level transfer method of cantilever array on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride (Si3N 4) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric SisN4 cantilevers. The thermo-piezoelectric Si3N4 cantilever arrays were fabricated with a conventional p-type silicon wafer instead of a SOI wafer. Furthermore, we have developed a wafer-level cantilever transfer process, which requires only one step of cantilever transfer process to integrate the CMOS circuit with the cantilevers. Using this process, we have fabricated a single thermo-piezoelectric Si3N4 cantilever, and recorded 65nm data bits on a PMMA film. And we have successfully applied this method to transfer 34×34 thermo-piezoelectric Si3N4 cantilever arrays on a CMOS wafer. Finally, We obtained reading signals from one of the cantilevers.en_US
dc.description.sponsorshipThis work is supported by “The program for the Development of the Next Generation Ultra-High Density Storage” of the Ministry of Commerce, Industry and Energy.en_US
dc.language.isoen_USen_US
dc.publisherIEEEen_US
dc.titleWAFER-LEVEL TRANSFER OF THERMO-PIEZOELECTRIC Si3N4 CANTILEVER ARRAY ON A CMOS CIRCUIT FOR HIGH DENSITY PROBE-BASED DATA STORAGEen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/MEMSYS.2006.1627951-
dc.contributor.googleauthorKim, Y.-S.-
dc.contributor.googleauthorNam, H.-J.-
dc.contributor.googleauthorJang, S.-
dc.contributor.googleauthorLee, C.S.-
dc.contributor.googleauthorJin, W.-H.-
dc.contributor.googleauthorCho, I.-J.-
dc.contributor.googleauthorBu, J.-U.-
dc.contributor.googleauthorChang, S.-I.-
dc.contributor.googleauthorYoon, E.-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING-
dc.identifier.pidsunyonglee-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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