High-frequency-measurement-based IC package performance evaluation
- Title
- High-frequency-measurement-based IC package performance evaluation
- Author
- 어영선
- Keywords
- Power distribution net; transmission line; Frequency variant circuit model; Skin effect; BGA Package; S-parameters
- Issue Date
- 2007-10
- Publisher
- 대한전자공학회
- Citation
- ISOCC 2007 Conference, Page. 513 - 516
- Abstract
- The frequency-variant characteristics of a
pair of package power and ground net are experimentally
investigated and modeled by using frequency-variant
grid-type equivalent circuits, where each cell of the grid
is modeled with vertically stacked RLC-ladder circuits.
The test patterns are characterized by using TDR/TDT
and VNA. Based on the experimental characterizations,
not only are material constants and circuit model
parameters determined, but also the conductor roughness
and other frequency-variant effects are modeled. It is
shown that the SPICE-based circuit simulation using the
proposed circuit model has an excellent agreement with
the measurement data in the range of 100MHz ~ 15GHz.
Then, it is also shown that the various types of package
performance evaluations can be very efficiently as well as
accurately achieved with the proposed technique.
- URI
- http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01789668&language=ko_KRhttps://repository.hanyang.ac.kr/handle/20.500.11754/107089
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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