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Resist Reflow Modeling Including Surface Tension and Bulk Effect

Title
Resist Reflow Modeling Including Surface Tension and Bulk Effect
Author
오혜근
Keywords
resist reflow; bulk effect; array; surface tension; lithography
Issue Date
2007-04
Publisher
INST PURE APPLIED PHYSICS
Citation
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, v. 46, No. 4A, Page. 1757-1762
Abstract
Resist reflow is a simple and cost-effective technique of fabricating a sub-100 nm contact hole (CH) pattern. The predominant factors affecting resist reflow include baking temperature and time, the volume surrounding the CH, the pattern layout, and the resist material properties. Thus, to optimize the layout design and process parameters, we developed a simple resist flow model that could predict the resist reflow tendency as functions of the reflow temperature, CH size, and the initial shape, the pitch and irregularity of CH array. The basic fluid equation was used to express the flow of the resist, and the variations of viscosity and density as functions of reflow temperature and time were considered. We also included the surface tension and bulk effect in our reflow model, so that we could see the difference in CH surface roundness with different surface tensions. We could also see the difference in CH size among the irregular CHs and those with different duty ratios by including the bulk effect. Moreover, we simply attempted to correct the critical dimension difference with pitch as imposing a bias on each after-development contact hole.
URI
https://iopscience.iop.org/article/10.1143/JJAP.46.1757http://repository.hanyang.ac.kr/handle/20.500.11754/106403
ISSN
0021-4922
DOI
10.1143/JJAP.46.1757
Appears in Collections:
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학) > APPLIED PHYSICS(응용물리학과) > Articles
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