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Contamination Particles and Plasma Etching Behavior of Atmospheric Plasma Sprayed Y2O3 and YF3 Coatings under NF3 Plasma

Title
Contamination Particles and Plasma Etching Behavior of Atmospheric Plasma Sprayed Y2O3 and YF3 Coatings under NF3 Plasma
Author
오성근
Keywords
yttrium oxide (Y2O3); yttrium oxyfluoride (YOF); yttrium fluoride (YF3); atmospheric plasma spraying (APS); contamination particle; plasma etching; NF3 plasma
Issue Date
2019-02
Publisher
MDPI
Citation
COATINGS, v. 9, Issue 2, Page. 1-8
Abstract
Yttrium oxide (Y2O3) and yttrium oxyfluoride (YO0.6F2.1) protective coatings were prepared by an atmospheric plasma spraying technique. The coatings were exposed to a NF3 plasma. After the NF3 plasma treatment, the mass loss of the coatings showed that the etching rate of YO0.6F2.1 was larger than that of the Y2O3. X-ray photoelectron spectroscopy revealed that YO0.5F1.9 was present in the Y2O3 coating, whereas YO0.4F2.2 was present in the YO0.6F2.1 coating. Transmission electron microscope analysis conducted on contamination particles generated during the plasma etching showed that both coatings were mainly composed of YFx. The contamination particles estimated by in-situ particle monitoring sensor revealed that the YO0.6F2.1 compared with the Y2O3 coatings produced 65% fewer contamination particles.
URI
https://www.mdpi.com/2079-6412/9/2/102https://repository.hanyang.ac.kr/handle/20.500.11754/103674
ISSN
2079-6412
DOI
10.3390/coatings9020102
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > CHEMICAL ENGINEERING(화학공학과) > Articles
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