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Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage

Title
Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage
Author
김학성
Keywords
Anisotropic shell model; initial warpage; microelectronic package; printed circuit board (PCB); warpage simulation
Issue Date
2016-11
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v. 6, Issue 11, Page. 1667-1676
Abstract
In this paper, the warpage simulation of a high-density multilayer printed circuit board (PCB) for solid-state disk drive (SSD) and microelectronic package was performed using the anisotropic viscoelastic shell modeling technique. The thermomechanical properties of various copper patterns were homogenized with the anisotropic shell model, which considered their viscoelastic properties. Then, warpage simulations of an SSD PCB unit/array and a full microelectronic package were performed; these simulations accounted for the initial warpage that occurred during fabrication using ABAQUS combined with a user-defined subroutine. Finally, it was demonstrated that both the maximum warpage and the remaining residual warpage of the full microelectronic package can be accurately predicted.
URI
https://ieeexplore.ieee.org/document/7587346https://repository.hanyang.ac.kr/handle/20.500.11754/100952
ISSN
2156-3950; 2156-3985
DOI
10.1109/TCPMT.2016.2612637
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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