Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage
- Title
- Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage
- Author
- 김학성
- Keywords
- Anisotropic shell model; initial warpage; microelectronic package; printed circuit board (PCB); warpage simulation
- Issue Date
- 2016-11
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Citation
- IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v. 6, Issue 11, Page. 1667-1676
- Abstract
- In this paper, the warpage simulation of a high-density multilayer printed circuit board (PCB) for solid-state disk drive (SSD) and microelectronic package was performed using the anisotropic viscoelastic shell modeling technique. The thermomechanical properties of various copper patterns were homogenized with the anisotropic shell model, which considered their viscoelastic properties. Then, warpage simulations of an SSD PCB unit/array and a full microelectronic package were performed; these simulations accounted for the initial warpage that occurred during fabrication using ABAQUS combined with a user-defined subroutine. Finally, it was demonstrated that both the maximum warpage and the remaining residual warpage of the full microelectronic package can be accurately predicted.
- URI
- https://ieeexplore.ieee.org/document/7587346https://repository.hanyang.ac.kr/handle/20.500.11754/100952
- ISSN
- 2156-3950; 2156-3985
- DOI
- 10.1109/TCPMT.2016.2612637
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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