김영호
2018-02-05T01:14:43Z
2018-02-05T01:14:43Z
2016-03
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v. 163, NO 6, Page. 250-255
0013-4651
1945-7111
http://jes.ecsdl.org/content/163/6/D250
http://hdl.handle.net/20.500.11754/35368
We investigated the effects of bath composition on the adhesion characteristics of electroless Cu on epoxy-based polymer substrates. The Cu layer was electroless-plated on the epoxy-based polymer substrate via four electroless-plating baths. A Cu layer was electroplated, which was then cured at 150 degrees C for 1 h. The adhesion was evaluated using a 90 degrees peel test. The size of the nodules and grains found in the electroless Cu layers decreased with increasing electrolyte concentration in the plating bath, resulting in increased hardness. At the highest electrolyte concentration, the electroless Cu layer exhibited high porosity in conjunction with the least coverage. The porosity of the electroless Cu layer decreased and the coverage improved with decreasing electrolyte concentration; however, a non-uniform layer formed at the lowest electrolyte concentration. The peel strength increased initially with the bath concentration, and then decreased upon further increase in bath concentration. The variation of the peel strength was related to the coverage and the hardness of the electroless Cu layer. We utilized a two-step electroless-plating method (the first layer with better coverage and second layer with larger ductility). The peel strength of the optimized double-layered electroless Cu layer was higher than that of the single-layered electroless Cu layer. (C) 2016 The Electrochemical Society. All rights reserved.
This research was financially supported by Daeduck Electronics co. Ltd.
en
ELECTROCHEMICAL SOC INC
COPPER DEPOSITION
BARRIER LAYERS
SEED LAYER
PERFORMANCE
STRENGTH
NUCLEATION
FILM
Effects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substrates
Article
6
163
10.1149/2.0721606jes
250-255
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Seong, Haseob
Kim, Sun-Chul
Choi, Dong Joo
Lee, Ja-Yeon
Ko, Young-Joo
Yoon, Suk-beom
Seo, Mi-lim
Kim, Young-ho
2016002465
S
COLLEGE OF ENGINEERING[S]
DIVISION OF MATERIALS SCIENCE AND ENGINEERING
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