박진성
2019-07-23T05:14:24Z
2019-07-23T05:14:24Z
2019-01
JOM, v. 71, NO 1, Page. 197-211
1047-4838
1543-1851
https://link.springer.com/article/10.1007%2Fs11837-018-3150-3
https://repository.hanyang.ac.kr/handle/20.500.11754/107698
Recent trends in thin film encapsulations (TFEs), fabricating organic/inorganic encapsulation films are reviewed. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. However, organic film should be combined with a hybrid structure for improved flexibility and longer lag time. We introduce various organic deposition methods and mechanisms for enhancing barrier performance. However, stress engineering is required to achieve high performance TFEs for flexible devices, new materials and deposition methods. First, modulating the internal stress in TFEs should be considered to increase flexibility by adopting other layers that can reduce internal stress. Second, controlling the configuration of the hybrid structure can prevent degradation due to cracks. Third, the introduction of a neutral plane as the middle layer decreases the strain. The results summarize how the device can improve barrier performance under external stress. This paper can guide the improvements in barrier performance.
This research was supported by the MOTIE (Ministry of Trade, Industry & Energy (#10080633) and KSRC (Korea Semiconductor Research Consortium) support program for the development of the future semiconductor device. And this work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (NRF-2017R1D1A1B03034035).
en
SPRINGER
LIGHT-EMITTING-DIODES
GAS-DIFFUSION BARRIERS
CHEMICAL-VAPOR-DEPOSITION
MOISTURE-BARRIER
FUNCTIONAL DESIGN
SIOX/SINX STACKS
ALUMINUM-OXIDE
WATER-VAPOR
HOT-WIRE
TRANSPARENT
Review of Organic/Inorganic Thin Film Encapsulation by Atomic Layer Deposition for a Flexible OLED Display
Article
1
71
10.1007/s11837-018-3150-3
197-211
JOM
Lee, Seunghwan
Han, Ju-Hwan
Lee, Seong-Hyeon
Baek, Geon-Ho
Park, Jin-Seong
2019002061
S
COLLEGE OF ENGINEERING[S]
DIVISION OF MATERIALS SCIENCE AND ENGINEERING
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