Browsing byAuthor조영정
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| 2022 | Prediction of mechanical reliability considering the usage environment of the solder joint of various semiconductor products | 조영정 |
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| 2022 | Prediction of mechanical reliability considering the usage environment of the solder joint of various semiconductor products | 조영정 |
