| 2020-06 | The adsorption and removal of corrosion inhibitors during metal CMP | 김태곤 |
| 2016-09 | Atomic resolution quality control for Fin oxide recess by atomic resolution profiler | 김태곤 |
| 2023-02 | Boosting performance of CdTe photocathode with pulse-reverse electrodeposited nickel telluride-nickel phosphide dual co-catalysts | 김태곤 |
| 2020-07 | Characterization of Different Cobalt Surfaces and Interactions with Benzotriazole for CMP Application | 김태곤 |
| 2022-01 | Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant | 김태곤 |
| 2020-10 | Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process | 김태곤 |
| 2020-12 | Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process | 김태곤 |
| 2021-02 | Effect of Dissolved Oxygen on Removal of Benzotriazole from Co During a Post-Co CMP Cleaning | 김태곤 |
| 2022-05 | Effect of Skin Layer on Brush Loading, Cross-Contamination, and Cleaning Performance during Post-CMP Cleaning | 김태곤 |
| 2021-02 | The Effect of Thermal Aging on Nano-Particle Removal | 김태곤 |
| 2021-02 | Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND | 김태곤 |
| 2020-02 | Hybrid DHF and N-2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 김태곤 |
| 2016-10 | In-Line Critical Dimension and Sidewall Roughness Metrology Study for Compound Nanostructure Process Control by in-Line 3D Atomic Force Microscope | 김태곤 |
| 2019-10 | Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process | 김태곤 |
| 2023-08 | Investigation of Selective Wet Etching of SiGe Substrates for High-Performance Device Manufacturing | 김태곤 |
| 2021-04 | Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning | 김태곤 |
| 2021-02 | Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process | 김태곤 |
| 2021-03 | Mechanisms of colloidal ceria contamination and cleaning during oxide post CMP cleaning | 김태곤 |
| 2019-12 | Nanocatalyst-induced hydroxyl radical (·OH) slurry for tungsten CMP for next-generation semiconductor processing | 김태곤 |
| 2023-11 | Photoelectrochemical Properties of Pulse-Reverse Electrodeposited Sb2Se3/TiO2 Nanotube Photoanodes' Controlled Sb2Se3 Overlayer | 김태곤 |
| 2019-01 | Post-CMP Cleaning of InGaAs Surface for the Removal of Nanoparticle Contaminants for Sub-10nm Device Applications | 김태곤 |
| 2017-12 | Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology | 김태곤 |
| 2019-08 | Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning | 김태곤 |
| 2022-02 | Study on PVA Brush Loading and Conditioning during Shallow Trench Isolation Post-CMP Cleaning Process | 김태곤 |
| 2019-09 | Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process | 김태곤 |
| 2008-08 | 반도체 공정에서의 패턴 붕괴 및 입자 제거력의 관계 | 김태곤 |
| 2010-08 | 일개 도시와 농촌 주민의 낙상 두려움과 도구적 일상생활 동작 수행에 관한 연구 | 김태곤 |
