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Showing results 18 to 47 of 103

Issue DateTitleAuthor(s)
2005-06Calibration-Free Multichannel Ellipsometry for Retardance Measurement오혜근
2017-03CD Error Caused by Aberration and Its Possible Compensation by Optical Proximity Correction in Extreme-Ultraviolet Lithography오혜근
2007-02Characteristics and prevention of pattern collapse in EUV lithography오혜근
2006-11Chromeless phase lithography using scattering bars and zebra patterns오혜근
2005-03Contact hole reflow by finite element method오혜근
2008-02Critical dimension control for 32 nm node random contact hole array using resist reflow process오혜근
2007-09Critical dimension control for 32 nm random contact hole array with resist reflow process오혜근
2017-09Critical dimension variation caused by wrinkle in extreme ultra-violet pellicle for 3-nm node오혜근
2005-11Defect characterization of Ru/Mo/Si EUV reflector by optical modeling오혜근
2005-07Determination of the optical functions of various liquids by rotating compensator multichannel spectroscopic ellipsometry오혜근
2007-08Development of Calibration-Free Imaging Ellipsometry Using Dual-Rotation of Polarizer and Analyzer오혜근
2016-04Eco-friendly photolithography using water-developable pure silk fibroin오혜근
2006-02The effect of transmission reduction by reticle haze formation오혜근
2008-08Ellipsometry for Pellicle-Covered Surface오혜근
2006-02EUV lithography simulation for the 32 nm node오혜근
2005-05The evaluation of aberration effects according to pattern shape and duty ratio오혜근
2006-07Evaluation of partial coherent imaging using the modulation transfer function in immersion lithography오혜근
2006-02Evaluation of partial coherent imaging using the transfer function in immersion lithography오혜근
2016-03Feasibility of a new absorber material for high NA extreme ultraviolet lithography오혜근
2008-11Haze defects due to pellicle adhesive오혜근
2009-11Heat conduction from hot plate to photoresist on top of wafer including heat loss to the environment오혜근
2008-11Heat conduction to photoresist on top of wafer during post exposure bake process: I. Numerical Approach오혜근
2008-11Heat conduction to photoresist on top of wafer during post exposure bake process:II. Application오혜근
2016-01Impact of a deformed extreme ultraviolet pellicle in terms of the critical dimension uniformity오혜근
2015-07Impact of deformed extreme-ultraviolet pellicle in terms of CD uniformity오혜근
2017-03Impact of non-uniform wrinkles for a multi-stack pellicle in EUV lithography오혜근
2016-05The impact of the residual stress on the EUV pellicle오혜근
2017-01Impact of transmission non-uniformity of a wrinkled EUV pellicle for N5 patterning under various illuminations오혜근
2006-02Improvement of column spacer uniformity in a TFT LCD panel오혜근
2017-06Influence of a non-ideal sidewall angle of extreme ultra-violet mask absorber for 1×-nm patterning in isomorphic and anamorphic lithography오혜근

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