| 2009-04 | High-Frequency Characterization and Circuit Modeling of Via in Multi-Layered IC Package | 어영선 |
| 2008-11 | High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit Packages | 어영선 |
| 2007-03 | High-frequency-measurement-based frequency-variant transmission line characterization and circuit modeling for accurate signal integrity verification | 어영선 |
| 2007-10 | High-frequency-measurement-based IC package performance evaluation | 어영선 |
| 2002-09 | High-Temperature and High-speed Operation of a 1.3-μm Uncooled InGaAsP-InP DFB Laser | 어영선 |
| 2002-09 | High-temperature and high-speed operation of a 1.3-mu m uncooled InGaAsP-InP DFB laser | 어영선 |
| 2019-02 | IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters | 어영선 |
| 2020-02 | A New High-Frequency Characterization for Coupled Transmission Lines Fabricated on Lossy Organic Substrates | 어영선 |
| 2000-01 | A New On-Chip Interconnect Crosstalk Model and Experimental Verification for CMOS VLSI Circuit Design | 어영선 |
| 2000-05 | New Simultaneous Switching Noise Analysis and Modeling for High-Speed and High-Density CMOS IC Package Design | 어영선 |
| 2005-05 | A New TWA based Efficient Signal Integrity Verification Technique for Non-Uniform RLC Interconnect Lines | 어영선 |
| 2019-12 | New Wafer-Level High-Frequency Characterization of Coupled Transmission Lines | 어영선 |
| 2006-03 | Non-Physical pseudo-wave-based modal decoupling technique of multi-coupled co-planar transmission lines with homogeneous dielectric media | 어영선 |
| 2016-05 | A Novel Transmission Line Characterization Based on Measurement Data Reconfirmation | 어영선 |
| 2007-10 | A novel unified modal decoupling technique for efficient multi-conductor signal integrity verification | 어영선 |
| 2005-04 | Ohmic contacts of Pd/Zn/M(= Pd or Pt)/Au to p-type InP | 어영선 |
| 2005-04 | Ohmic Contacts of Pd/Zn/M(=Pd of Pt)/Au to p-Type InP | 어영선 |
| 2005-05 | Ohmic Contacts of Pd/Zn/Pt(or Pd)Au Materials to P-TYPE InP | 어영선 |
| 2001-06 | PDP 시스템의 EMI 예측을 위한 회로 모델링 및 실험적 검증 | 어영선 |
| 2002-02 | PDP 시스템의 EMI 예측을 위한 회로 모델링 및 실험적 검증 | 어영선 |
| 2023-12 | Resonance-frequency modulation for a robust RF SAW filter design against temperature variations | 어영선 |
| 2002-01 | RF 패키지 인덕턴스가 실리콘 기판 커플링에 미치는 영향 모델링 및 해석 | 어영선 |
| 2001-12 | RF 회로 설계를 위한 실리콘 기판 커플링 모델링, 해석 및 기판 파라미터 추출 | 어영선 |
| 2000-08 | S-parameter-Measurement-Based High-Speed Signal Transient Characterization of VLSI Interconnects on SiO2-Si Substrate | 어영선 |
| 2007-12 | Signal transient and crosstalk model of capacitively and inductively coupled VLSI interconnect lines | 어영선 |
| 2007-10 | Signal transient and crosstalk model of capacitively and inductively coupled VLSI interconnect lines | 어영선 |
| 2001-05 | Silicon Substrate Coupling Noise Modeling, Analysis, and Experimental Verification for Mixed Signal Integrated Circuit Design | 어영선 |
| 1999-11 | SOP RFIC 패키지 모델링 | 어영선 |
| 2008-12 | Timing Analysis of Discontinuous RC Interconnect Lines | 어영선 |
| 1998-03 | Trade-off between hot carrier effect and current driving capability due to drain contact structures in deep submicron MOSFETs | 어영선 |
