| 2016-03 | Broadband Thin-Film Transmission-Line Characterization for Accurate High-Frequency Measurements of On-Wafer Components | 어영선 |
| 2003-11 | A Compact Multi-Layer IC Package Model for Efficient Simulation, Analysis, and Design of High-Performance VLSI Circuits | 어영선 |
| 2004-09 | A Decoupling Technique for Efficient Timing Analysis of VLSI Interconnects With Dynamic Circuit Switching | 어영선 |
| 2004-05 | Design and Fabrication of a 10 Gb/s InGaAs/InP Avalanche Photodiode(APD) based on the Non-local Model | 어영선 |
| 2004-05 | The Effects of Semi-insulating Current Blocking Layers on Static and Dynamic Characteristics in Direct-modulated Semiconductor Lasers | 어영선 |
| 2006-03 | Efficient signal integrity verification method of multi-coupled RLC interconnect lines with asynchronous circuit switching | 어영선 |
| 2007-03 | Efficient signal integrity verification of multi-coupled transmission lines with asynchronously switching non-linear drivers | 어영선 |
| 2000-05 | Experimental Characterization and Modeling of Transmission Line Effects for High-Speed VLSI Circuit Interconnects | 어영선 |
| 2019-08 | Experimental Complex Permittivity Characterization of Mixed Dielectric Materials over a Broadband Frequency | 어영선 |
| 2002-06 | Facet Reflectivity of a Spot-Size-Converter integrated Semiconductor Optical Amplifier | 어영선 |
| 2001-06 | Fast and Accurate Quasi-3-Dimensional Capacitance Determination of MultiLayer VLSI Interconnects | 어영선 |
| 2001-06 | Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects | 어영선 |
| 2009-11 | Fast Eye Diagram Determination for the Signal Integrity Verification of Frequency-Variant transmission lines | 어영선 |
| 2004-07 | Fe-doped InP semi-insulating buried heterostructure for high speed and high power operations in directly modulated semiconductor laser | 어영선 |
| 1995-05 | GENERALIZED COUPLED INTERCONNECT TRANSFER-FUNCTION AND HIGH-SPEED SIGNAL SIMULATIONS | 어영선 |
| 2002-12 | Generalized Traveling-Wave-Based Waveform Approximation Technique for the Efficient Signal Integrity Verification of Multicoupled Transmission Line System | 어영선 |
| 2009-04 | High-Frequency Characterization and Circuit Modeling of Via in Multi-Layered IC Package | 어영선 |
| 2008-11 | High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit Packages | 어영선 |
| 2007-03 | High-frequency-measurement-based frequency-variant transmission line characterization and circuit modeling for accurate signal integrity verification | 어영선 |
| 2007-10 | High-frequency-measurement-based IC package performance evaluation | 어영선 |
| 2002-09 | High-Temperature and High-speed Operation of a 1.3-μm Uncooled InGaAsP-InP DFB Laser | 어영선 |
| 2002-09 | High-temperature and high-speed operation of a 1.3-mu m uncooled InGaAsP-InP DFB laser | 어영선 |
| 2019-02 | IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters | 어영선 |
| 2020-02 | A New High-Frequency Characterization for Coupled Transmission Lines Fabricated on Lossy Organic Substrates | 어영선 |
| 2000-01 | A New On-Chip Interconnect Crosstalk Model and Experimental Verification for CMOS VLSI Circuit Design | 어영선 |
| 2000-05 | New Simultaneous Switching Noise Analysis and Modeling for High-Speed and High-Density CMOS IC Package Design | 어영선 |
| 2005-05 | A New TWA based Efficient Signal Integrity Verification Technique for Non-Uniform RLC Interconnect Lines | 어영선 |
| 2019-12 | New Wafer-Level High-Frequency Characterization of Coupled Transmission Lines | 어영선 |
| 2006-03 | Non-Physical pseudo-wave-based modal decoupling technique of multi-coupled co-planar transmission lines with homogeneous dielectric media | 어영선 |
| 2016-05 | A Novel Transmission Line Characterization Based on Measurement Data Reconfirmation | 어영선 |
