| 2011-04 | Random yield loss during wafer cleaning | 박진구 |
| 2011-04 | Random yield loss during wafer cleaning | 박진구 |
| 2004-06 | Reaction of Ozone and H2O2 in NH4OH Solutions and Their Reaction with Silicon Wafers | 박진구 |
| 2008-12 | Reevaluation of hydrogen gas dissolved cleaning solutions in single wafer megasonic cleaning | 박진구 |
| 2016-02 | Removal mechanisms of glass and sapphire materials by slurry free lapping | 박진구 |
| 2006-12 | Removal of backside particles by a single wafer megasonic system | 박진구 |
| 2017-12 | Removal of crn contamination from euv mask backside using dry cleaning | 박진구 |
| 2018-10 | Removal of EUV exposed hydrocarbon from Ru capping layer of EUV mask using the mixture of alkaline solutions and organic solvents | 박진구 |
| 2018-10 | Removal of EUV exposed hydrocarbon from Ru capping layer of EUV mask using the mixture of alkaline solutions and organic solvents | 박진구 |
| 2015-08 | Removal of Nano-sized Particles Using Carbon Dioxide (CO2) Gas Cluster Cleaning without Pattern Damage | 박진구 |
| 2015-09 | Removal of Nano-sized Particles Using Carbon Dioxide (CO2) Gas Cluster Cleaning without Pattern Damage | 박진구 |
| 2008-06 | Removal of Organic Wax and Particles on Final Polished Wafer by Ozonated DI Water | 박진구 |
| 2007-10 | Removal of organic wax and particles on silicon after batch type polishing by ozonated DI water | 박진구 |
| 2013-01 | Removal of UV cured resin using hybrid cleaning method | 박진구 |
| 2014-01 | Removal of UV-cured resin using a hybrid cleaning process for nanoimprint lithography | 박진구 |
| 2014-02 | Removal of UV-cured resin using a hybrid cleaning process for nanoimprint lithography | 박진구 |
| 2013-01 | Removing W Polymer Residue from BEOL Structures using DSP+ (Dilute Sulfurec-Peroxide-HF) Mixture - A Case Study | 박진구 |
| 2013-01 | Role of mask patterns in fabrication of Si nanotip arrays | 박진구 |
| 2013-01 | Role of mask patterns in fabrication of Si nanotip arrays | 박진구 |
| 2005-09 | Ruthenium CMP에서 Cerium Ammonium Nitrate와 알루미나 연마 입자가 연마 거동에 미치는 영향 | 박진구 |
| 2005-09 | Ruthenium CMP에서 Cerium Ammonium Nitrate와알루미나 연마 입자가 연마 거동에 미치는 영향 | 박진구 |
| 2008-12 | SAM modification of CMP conditioner for the prevention of particle adhesion | 박진구 |
| 2013-12 | Scratch formation and its mechanism in chemical mechanical planarization (CMP) | 박진구 |
| 2019-02 | Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning | 박진구 |
| 2019-05 | Selection of CVD Diamond Crystal Size on a CVD Pad Conditioner for Improved Lifetime | 박진구 |
| 2017-01 | Self-assembled monolayer modified MoO3/Au/MoO3 multilayer anodes for high performance OLEDs | 박진구 |
| 2017-01 | Self-assembled monolayer modified MoO3/Au/MoO3 multilayer anodes for high performance OLEDs | 박진구 |
| 2011-05 | A Self-Assembled Monolayer-Based Micropatterned Array for Controlling Cell Adhesion and Protein Adsorption | 박진구 |
| 2013-08 | Shockwave-induced deformation of organic particles during laser shockwave cleaning | 박진구 |
| 2013-08 | Shockwave-induced deformation of organic particles during laser shockwave cleaning | 박진구 |
