Browsing by Author 박진구

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Showing results 19 to 48 of 108

Issue DateTitleAuthor(s)
2011-10Effect of Acoustic Cavitation on Dissolved Gases and Their Characterization During Megasonic Cleaning박진구
2012-06Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon박진구
2014-02Effect of dissolved gases in water on acoustic cavitation and bubble growth rate in 0.83 MHz megasonic of interest to wafer cleaning박진구
2016-10Effect of Feature Spacing When Injection Molding Parts With Microstructured Surfaces박진구
2015-01Effect of FOUP atmosphere control on process wafer integrity in sub20nm device fabrication박진구
2014-05Effect of La doping of ceria abrasives for STI CMP박진구
2015-02Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation박진구
2018-10Effect of organic acids in dilute HF solutions on removal of metal contaminants on silicon wafer박진구
2015-10Effect of Particle Contamination on Extreme Ultraviolet (EUV) Mask and Megasonic Cleaning Process for Its Removal박진구
2016-05Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation박진구
2011-10Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System박진구
2011-01Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development박진구
2011-01Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development박진구
2014-01Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing박진구
2012-08Effective Carbon Contaminant Cleaning Condition Using Ozone Dissolved Water and Megasonic for Ru-Capped Extreme Ultraviolet Lithography Mask박진구
2012-04Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window박진구
2005-10The Effects of pH Adjustors in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal박진구
2011-11Electrochemical Characterization of Anti-Corrosion Film Coated Metal Conditioner Surfaces for Tungsten CMP Applications박진구
2012-08Electrochemical Impedance Spectroscopy (EIS) Analysis of BTA Removal by TMAH during Post Cu CMP Cleaning Process박진구
2011-10Electrochemical Impedance Spectroscopy (EIS) Analysis of BTA Removal by TMAH during Post Cu CMP Cleaning Process박진구
2011-06Enhanced Fluorescence by Controlled Surface Roughness of Plastic Biochip박진구
2011-04Enhancement of airborne shock wave by laser-induced breakdown of liquid column in laser shock cleaning박진구
2013-04Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates박진구
2013-01Evaluation of very dilute alkaline solutions for wafer cleaning with megasonic irradiation박진구
2013-08Fabrication of 3D micro structure by dual diffuser lithography박진구
2012-03Fabrication of a hydrophobic/hydrophilic hybrid-patterned microarray chip and its application to a cancer marker immunoassay박진구
2005-11Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA박진구
2018-04Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire박진구
2005-09Fabrication of Hot Embossing Plastic Stamps for Microstructure박진구
2016-06Fabrication of hydrophobic/hydrophilic switchable aluminum surface using poly(N-isopropylacrylamide)박진구

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