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Showing results 18 to 47 of 348

Issue DateTitleAuthor(s)
2006-12Characteristics of high power laser shock waves and their cleaning performance박진구
2016-12Characterization of ammonium silicate residue during Polysilazane (PSZ) dry etching in NF3/H2O gas chemistry박진구
2015-01Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning박진구
2014-12Characterization of Cu-BTA organic complexes on Cu during Cu CMP and post Cu cleaning박진구
2020-07Characterization of Different Cobalt Surfaces and Interactions with Benzotriazole for CMP Application박진구
2018-04Characterization of Free-Standing Nano-Membranes by Using Ellipsometry박진구
2018-04Characterization of Free-Standing Nano-Membranes by Using Ellipsometry박진구
2014-06Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution박진구
2014-06Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution박진구
2007-06Characterization of SUS Molds for light guide-plates by electro-chemical fabrication (ECF) method박진구
2013-02Characterization of TMAH based cleaning solution for post Cu-CMP application박진구
2013-02Characterization of TMAH based cleaning solution for post Cu-CMP application박진구
2004-02Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance박진구
2007-04Chemical and nanomechanical characteristics of fluorocarbon thin films deposited by using plasma enhanced chemical vapor deposition박진구
2000-11Chemical, optical and tribological characterization of perfluoropolymer films as an anti-stiction layer in micro-mirror arrays박진구
2021-12Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant박진구
2011-08Citric Acid and NaIO(4) Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning박진구
2011-08Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning박진구
2012-03CMP defects박진구
2011-12CMP defects박진구
2004-07CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교박진구
2010-01Collapse behavior and forces of multistack nanolines박진구
2020-10Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process박진구
2015-06Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size박진구
2015-05Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size박진구
2018-04Conductive and transparent submicron polymer lens array fabrication for electrowetting applications박진구
2017-12Conductive and transparent submicron polymer lens array fabrication for electrowetting applications박진구
2020-12Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process박진구
2009-10Convective Assembly and Dry Transfer of Nanoparticles Using Hydrophobic/Hydrophilic Monolayer Templates박진구
2011-12Correlation of polishing pad property and pad debris on scratch formation during CMP박진구

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